Board-to-Board Connectors - JAE|Japanese Avionics WP56DK Series 0.3mm Terminal Pitch Board-to-Board (FPC) Connectors Available

JAE|JAE Connectors|Japan Aerospace Electronics WP56DK Series Ultra-Compact Stackable Board-to-Board (FPC) Connector with Power Terminals 0.3mm Pitch is a 1.6mm width board-to-board (FPC) connector with the industry's narrowest terminal pitch of 0.3mm, by reducing the terminal pitch to 0.3mm (0.05mm compared to conventional connectors), the connector length of the 30 position connector will be reduced by 0.7mm. By reducing the terminal pitch to 0.3 mm (0.05 mm less than conventional connectors), the connector length of the 30-position connector will be reduced by 0.7 mm. The product utilizes JAE's standard multifunctional compression device, which can be used as a power terminal to reduce the total number of pins and connector size. In addition, the compression device incorporates protective metal fittings that provide armor for the mating and inner surfaces of the insulator for ultimate strength and reliability. As a result of this construction, the connector offers improved machinability during alignment and mating. [In high-performance compact wearable devices such as smartwatches, the PCBs inside these devices are much smaller than those inside smartphones, which requires that the components used in these devices are also much smaller and denser. Although the overall size of devices is decreasing, the functionality and features of these devices continue to evolve, further emphasizing the need for higher density components such as connectors. For smartphones, the mounting space for connectors has become even denser due to the increase in the number of camera modules. To meet these needs, JAE has introduced the 1.6 mm wide WP56DK series board-to-board (FPC) connector with the industry's narrowest terminal pitch of 0.3 mm]; its key features are: 0.3 mm pitch, industry's narrowest, 1.6 mm wide, 2 rows, 0.6 mm high, 2 power terminals each supporting 3.0 A (also used as a compression device), compression structure for increased Protection of the top mating surface to prevent damage to the insulator (armor), improves the assembler's maneuverability, clear clicking sensation when fully matched, two-point contact structure for reliable connection, nickel barrier layer on the contacts prevents solder core suction, supports MIPI, USB3.1 2nd generation and PCIe 3rd generation transmission; Main applications are: smartwatches, smartphones, tablets, laptops, digital cameras, AR/VR headsets and other small mobile devices.

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